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| PCB Manufacture Capabilities |
No |
Items |
Capabilities(for Sample) |
Capabilities(for Mass Production) |
1 |
Layer count |
1-30L |
1-16 Layer |
2 |
Board Thickness |
0.2-7.0mm |
0.4-6.0mm |
3 |
Maximum Board Size |
610*1100mm |
550*650mm |
4 |
Copper Thickness |
Inner Layer: H-6OZ |
Inner Layer: H-4OZ |
| Outer Layer: H-7OZ |
Outer Layer: H-5OZ |
5 |
Minimum Finished Hole Size |
0.1mm |
0.15mm |
6 |
Hole Diameter Tolerance |
PTH: ¡À0.05mm |
PTH: ¡À0.075mm |
| NPTH: ¡À0.05mm |
NTTH: ¡À0.05mm |
7 |
Maximum Aspect Ratio |
16:1 |
10:1 |
8 |
Minimum Line Width |
3.0mil |
3.0mil |
9 |
Minimum Line Spacing |
3.0mil |
3.0mil |
10 |
Outline Size Tolerance |
¡À0.10mm |
¡À0.15mm |
11 |
Minimum Bow and Twist |
0.50% |
0.75% |
12 |
Soldermask Color |
Green,Yellow,Black,Blue,
Red,White,Purple |
Green,Yellow,Black,Blue,
Red,White,Purple |
13 |
Minimum Solder Mask Dam |
4mil(Green),
5mil(Other color) |
4mil(Green),
5mil(Other color) |
14 |
Silkscreen Color |
White,Yellow,Black |
White,Yellow,Black |
15 |
HASL Tin Thickness |
2-40um |
2-40um |
16 |
Flash Gold(electroplated gold) |
Ni:¡Ý3um;Au:0.025-0.1um |
Ni:¡Ý3um;Au:0.025-0.1um |
17 |
ENIG |
Ni:3-8um;Au:0.05-0.1um |
Ni:3-8um;Au:0.05-0.1um |
18 |
Immersion Tin |
¡Ý1.0um |
¡Ý1.0um |
19 |
Immersion Silver |
0.2-0.4um |
0.2-0.4um |
20 |
OSP |
0.1-0.3um |
0.1-0.3um |
21 |
Hard Gold |
0.1-4.0um |
0.1-4.0um |
22 |
ENEPIG |
Ni:3-8um;
Pd:0.05-0.15um;
Au:0.05-0.1um |
Ni:3-8um;
Pd:0.05-0.15um;
Au:0.05-0.1um |
23 |
Carbon |
0.10-0.35um |
0.10-0.35um |
24 |
Peelable Solder mask |
0.20-0.50mm |
0.20-0.50mm |
25 |
Raw Material |
FR-4,High Tg FR-4,
Halogen-Free,PTFE,Aluminum
base material,Ceramic Partide Filled Laminates |
FR-4,High Tg FR-4,Halogen-Free,PTFE,Aluminum base material,Ceramic Partide Filled Laminates |
26 |
Surface Treatment |
Sn/Pb HASL,
Leadfree HASL,
FlashGold,
ENIG,Immersion Tin,
Immersion Silver, OSP(Entek),Hard Gold,
Soft Gold,ENIG+OSP,
ENIG+Gold finger,
Hard Gold+Gold finger,
Immersion Silver+Gold finger,
Immersion Tin+Gold finger,ENEPIG |
Sn/Pb HASL,
Leadfree HASL,
FlashGold,ENIG,
Immersion Tin,
ImmersionSilver,
OSP(Entek),
Hard Gold,Soft Gold,
ENIG+OSP,
ENIG+Gold finger,
Hard Gold+Gold finger,
Immersion Silver+Gold finger,Immersion Tin+Gold finger,ENEPIG |
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